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Tyler Osborne

Person

Heard in 1 episode across 1 show since Oct 2026

Tyler Osborne is a director in Intel's Advanced Packaging Technology Development Group.

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Episodes

1
across 1 show

First heard

Oct 2026

Guest appearances

1

Episodes per month

Public PodLume episodes featuring it, over the last year.

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MonthEpisodes
Nov 20250
Dec 20250
Jan 20260
Feb 20260
Mar 20260
Apr 20260
May 20260
Jun 20260
Jul 20260
Aug 20260
Sep 20260
Oct 20261

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What Tyler Osborne has said on podcasts

2 statements

  1. on Intel hybrid bondingPositiveOct 22, 2026· Dwarkesh Podcast

    Intel hybrid bonding has reached sub-10-micrometer pitch in development.

    “Today in HVM, we're doing 25 micrometer pitch in Foveros. Here we're doing sub-10”

    Listen at 45:44

    Open the episode · What will computer chips look like in 2045?
  2. on hybrid bonding interconnectsPositiveOct 22, 2026· Dwarkesh Podcast

    Finer hybrid-bonded interconnects reduce interface power consumption.

    “as you get to finer and finer interconnects, you can reduce the total power consumption in picojoules per bit for that interface.”

    Listen at 47:39

    Open the episode · What will computer chips look like in 2045?

Statements are attributed to the speaker as said on the episode and reflect their view at the time, not PodLume's. They are not advice.

Episodes

1 episode featuring Tyler Osborne, newest first